Multi-chip Package Solutions

High performance memories for reliable instant-on systems

Infineon multi-chip package (MCP) solutions enable feature rich applications in space constrained designs by combining high-performance Infineon Flash memory and other high quality memory devices into a single small, consistent footprint.

Small footprint, consistent packaging

Cellular handset designers and other leading manufacturers face many challenges providing the latest features in decreasing footprints. Infineon MCP devices meet these challenges by offering a single, space-saving package with the performance and quality that customers expect from Infineon products.

Because the various Infineon MCP solutions are stacked in a consistent footprint and pinout, you can easily design a single-board using a universal MCP footprint and provide differentiated products without redesigning your board. In addition, the advanced stacking technology utilized can readily be applied to new Flash, SDRAM or other devices as they are introduced.

Streamline the supply chain

As a high volume consumer of SRAMs and pSRAMs for integration into MCPs, Infineon can secure supply at reduced prices and pass on those savings to you. In addition, we manage the complex logistics, quality and inventory management issues that can arise when procuring memory, thereby enabling you to streamline your supply chain.