Infineon provides high performance and reliable Known Good Die (KGD) products for custom system-in-package (SiP) and multi-chip package (MCP) solutions requiring memory.
Infineon leverages from its extensive experience to provide KGD products for the most demanding application segments and is committed to deliver KGD products with the same level of performance and reliability as packaged parts, through:
As a result, our customers benefit from reduced SiP manufacturing yield loss and decreased memory related product reliability issues.
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